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Features:  
Extra-large Inertially Balanced Linear Scanner with counterweight to minimize vibrations and ensure optimal scanning results

• AutoScan™ allows you to program specific scan parameters and coordinates to quickly and repeatedly analyze specific regions of interest on multiple samples

Digital Image Analysis (DIA)™ uses advanced algorithms to quantify the acoustic data and allows you to set accurate, automatic, accept/reject criteria

• Multi-Language OS & Visual Acoustics™ interface allows technicians and operators to work in their native language. Includes English, Chinese and Japanese

• Temperature Control options to maintain precise water temperature and ensure consistent imaging throughout the day, regardless of changes in ambient air temperature

• Applications Setup Wizard™ and C-SAM Interactive™ helps users easily learn and set up new applications for optimal results

Quantitative B-Scan Analysis Mode (Q-BAM™) incorporates Sonoscan’s proprietary B-scan mode to provide a virtual cross-sectional view with accurate polarity and depth data
D24™
Robustness and Accuracy for Large Samples
The D24™ is a semi-automated factory floor instrument capable of scanning boards and samples up to 24”, or accommodating up to six JEDEC trays of components at one time. The D24 delivers the robustness and accuracy of Sonoscan’s top lab instrument, but with very large area coverage capabilities. Plus, the analysis can be programmed to be performed without operator assistance, freeing your personnel for other duties while the inspection is in progress.

The D24 accommodates even the largest boards and permits acoustic micro imaging of components mounted on the board. During the initial scan, each component is inspected while the D24 learns the x-y coordinates of each. It also learns the z coordinate and, equally important, the specific internal depth to be scanned. For a flip chip, for example, the level of interest may be the die-to-underfill interface. For a conventional IC package or a BGA, the level of interest may be the die attach. The D24 software can even store gating information for two or more depths of interest per component.

Because not all components will have the exact same position from board-to-board, the D24 intelligently detects the x, y, and z coordinates and makes minor adjustments as needed, storing a detailed and highly accurate acoustic image of each component. It can also automatically analyze each image. For example, if it detects a void in a die attach layer, software measures the area of the void as a percentage of the whole die attach area. This makes it much easier to comply with standards such as Mil-Std-883, Method 2030, and makes it easier to determine the level of significance of any single defect.

At the end of the scan, you’ll have a clear "acoustic picture" of the board. If there are a few components which should be replaced, you’ll know exactly which components they are, and the reason for rework. If the same component is defective on board after board, the problem can be identified and solved. The result is defect-free output with potentially no reduction in total throughput.


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